Amaoe PD-C Tin Plainting Pad with Universal Mobile Phone BGA Chip Base for CPU IC BGA Reballing Stencil Rework Adsorption Repair

👍: 100.0%

AMAOE PD-C Planting Tin Pad Universal Magnetic BGA Reballing Platform for iPhone 6-15 Phone CPU IC Rework Adsorption Silicon Mat

👍: 97.5%

Heat Insulation Planting Tin Pad for Mobile Phone Repair AMAOE PD-C BGA Reballing Platform CPU IC  Rework Adsorption Silicon Mat

👍: 100.0%

AMAOE PD-C Planting Tin Pad Universal Magnetic BGA Reballing Platform for iPhone 6-15 Phone CPU IC Rework Adsorption Silicon Mat

👍: 99.2%

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中国版 中文国际版 International 京ICP备2023018498号-1